Shenzhen Semiconductor Expo

Shenzhen Semiconductor Expo China is one of the largest and most authoritative semiconductor exhibitions in China. The exhibition area of ​​the previous exhibition was 50,000 square meters, attracting more than 600 companies from all over the world from more than 70 countries and regions. At the same time, a number of technical forums such as the “International Semiconductor Technology and Application Exchange Conference” will be held, inviting domestic and foreign experts and participants to interact, discuss the development trends of industry and to share their experiences and results. Until then, domestic and foreign semiconductor enterprises and related industries will be warmly welcomed to visit and communicate.

Shenzhen Semiconductor Exhibition (China Semiconductor Exhibition) will focus on showcasing the latest products and technologies of semiconductor industry, establishing brand images for enterprises, promoting of business cooperation and market development, on key industry trends, on strengthening the interaction between production, R&D and sales and gaining in-depth understanding. new trends in the future development of the semiconductor market, explore the new needs of the future semiconductor market from a development perspective, innovate the connotation of the exhibition, organize professional audiences comprehensively and multi-party levels and provide exhibitors and exhibitors with the best platform for technical exchanges, product presentation and commercial negotiations.

Well-known exhibitors at Shenzhen Semiconductor Expo China include: Suzhou Jingfang, Northern Huachuang, Shengmei, Changdian Technology, Suzhou Heritage, Shenzhen Han’s, Huatian Technology, Changchuan Technology, Jilin Huawei, Xi’an Dieter, Camfield, Wechong Semiconductor, Kunshan Xinlai, Yingjie electric, video, disco, etc.

1. Semiconductor equipment and intelligent equipment: packaging equipment, diffusion equipment, welding equipment, cleaning equipment, testing equipment, refrigeration equipment, oxidation equipment, thinning machines, dicing machines , placement machines, single crystal furnaces, oxidation furnaces, grinding machines, heat treatment equipment, photolithography machine, engraving machine, polishing machine, chamfering machine, ion implantation equipment, CVD/PVD equipment, coating/coating machine glue development, front end testing equipment, wet processing equipment, heat treatment, coating equipment, single chip sink Accumulation system, die bonding machine, plasma cleaning equipment, cutting machine, die loading machine chips, bonding machine, wire bonding machine, plastic sealing machine, reflow soldering, wave soldering, testing machine, bending equipment, sorting machine, robot automation, machine vision, other materials and special electronic equipment, coupling machines, carrier strip forming machines, test equipment, constant temperature and humidity test chambers, sensors, packaging molds, test fixtures, precision slides, stepper motors, valves, probe stations, clean room equipment, water treatment, etc.

2. Wafer manufacturing and packaging: wafer manufacturing, advanced SiP packaging, OSAT, EMS, OEM, IDM, silicon wafers and IC packaging support boards, printed circuit boards, substrates and packaging equipment, assembly and testing, etc., packaging design, testing, equipment and application manufacturing and packaging testing, EDA, MCU, printed circuit boards, etc. ;

3. Packaging and testing support equipment: test probe station, probe board, testing machine, sorting machine, packaging equipment, packaging substrate, lead frame bonding wire, bonding wire, solder test, automated test, laser cutting and others, grinding fluid, fluid dicing, sealing film (glue), high temperature tape, laminated substrate, adhesive patch, loading plate, flow control wire, quartz graphite, silicon carbide, etc. ;

4. Integrated circuit design: design of integrated circuits and related electronic products, integrated circuit application products and technologies, integrated circuit test methods and test instruments, integrated circuit design and design tools, manufacturing and IC Packaging, EDA, IP Design, Embedded Software, Digital Circuit Design, Simulation with Mixed Signal Circuit Design, IC Design, IDM, Fabless Factory, etc. ;

5. Integrated circuits: wafer manufacturing plants, wafer foundries, analog integrated circuits, digital integrated circuits, digital and analog hybrid integrated circuit manufacturing, integrated circuit terminal products, etc. ;

6. Semiconductor materials: silicon wafers and silicon-based materials, silicon wafers, silicon wafers, monocrystalline silicon, silicon wafers, silicon-germanium materials, S01 materials, silicon materials for solar cells and semiconductor materials -compound conductors, quartz products, graphite products, electrostatic protection. supporting materials, photoresist and reagents, adhesive tape, photomasks, electronic gases, specialty chemical gases, CMP polishing materials, packaging substrates, lead frames, bonding wires, encapsulation materials, ceramic substrates, bonding materials chips, photoresist materials, wet electronic chemicals, sputtering target materials, sealing materials, wafers, grinding sheets, polishing sheets, films, etc. ;

7. Third generation semiconductors: third generation semiconductors silicon carbide SiC, gallium nitride GaN, wafers, substrates, packaging, testing, optoelectronic devices (LED light emitting diodes, LD laser, UV detector), electronic devices of power (diodes, MOSFET, JFET, BJT, IGBT, GTO, ETO, SBD, HEMT, etc.), microwave radio frequency devices (HEMT, MMIC), etc. ;

8. Electronic components: resistors, capacitors, potentiometers, electronic tubes, radiators, electromechanical components, connectors, discrete semiconductor/IGBT devices, electroacoustic devices, laser devices, electronic display devices, optoelectronic devices, sensors, power supplies, switches , micromotors, electronic transformers, relays, printed circuit boards, integrated circuits, various circuits, piezoelectrics, crystals, quartz, ceramic magnetic materials, printed circuits Base material used substrates, special materials for electronic functional processes, electronic adhesive products (tapes ), Electronic chemical materials and parts, passive devices, 5G core components, special electronics, components, power management, storage, connectors, cables, pluggable devices, crystal oscillators, resistors, potentiometers, magnetic components, filter components , PCB boards, motor fans, electroacoustic devices, display devices, diodes, transistor filter components, etc. ;