Shenzhen High-Tech Fair Semiconductor Display Show

The Shenzhen Hi-Tech Fair Semiconductor Display Exhibition, namely CTFEIAS (abbreviation: Hi-Tech Fair Semiconductor Exhibition), is scheduled to be held from November 14 to 16, 2024. The venue of this exhibition is located at the International Convention and Exhibition Center. Shenzhen exhibitions (Bao’an Hall). The specific location is No. 1 Zhancheng Road, Fuyong Street, Bao’an District, Shenzhen City, Guangdong Province, China. As an important event in the semiconductor industry, Hi-Tech Semiconductor will bring together the world’s leading semiconductor technologies, products and solutions, providing a platform for exhibitors to showcase, communicate and cooperate.

The Shenzhen Hi-Tech Fair Semiconductor Display Exhibition, whose full name is China Hi-Tech Fair Semiconductor Display Exhibition (CHTF), is an important part of the Shenzhen Hi-Tech Fair (China Hi-Tech Fair, referred to as CHTF). . The high-tech fair is one of the largest and most influential national science and technology industry exhibitions in China. It is usually held at the Shenzhen Convention and Exhibition Center and aims to showcase high-tech achievements and promote scientific and technological exchanges and cooperation. Since its establishment in 2004, the Shenzhen Semiconductor Display Exhibition has become a recognized national semiconductor industry trade fair in the optoelectronic display industry. The exhibition focuses on the fields of new display technologies, flat panel displays, display materials, testing equipment and instruments, providing exhibitors and visitors with a platform to learn more about the latest industry developments, showcase technological innovations and find opportunities for business cooperation. The exhibition focuses on semiconductor and display technology and attracts a large number of professional visitors and industry experts.

The organizer and official of the Hi-Tech Fair semiconductor exhibition is the Shenzhen China International High-tech Achievements Trading Center. The exhibitor list and exhibitor list of the exhibition are as follows: Microsoft, IBM, Sony, Qualcomm, Samsung, HP, Siemens, Toshiba, Oracle, LG, Hitachi, Panasonic, Tencent, Huawei, Kingdee, iFlytek, Han’s Laser, Tongzhou Electronics. etc.

Hi-Tech Fair Semiconductor tickets are electronic tickets. When applying for tickets, you must link your ID card information to your real name. You can access the exhibition with your ID card and e-ticket.

Semiconductor field and materials field: including large silicon wafers, targets, photoresists, packaging materials, etc. Semiconductor manufacturing equipment: such as photolithography machines, etching machines, coating machines and other equipment used for wafer manufacturing. Packaging and Testing Equipment: Various equipment involved in chip packaging and testing. Electronic components: including chips, resistors, capacitors, transistors and other electronic components. Spare Parts Exhibition Area: Displays various parts and accessories used in the semiconductor manufacturing process.

Display Technology Zone New Display Zone: Introducing new display technologies such as OLED, QLED, Micro LED, Mini LED, etc. Display panel area: including LCD, AMOLED and other types of display screens. Commercial display area: involving commercial display solutions such as large screen displays, digital signage and touch screens. Display hardware area: display components such as polarizers, color filters, backlights, etc. Equipment Inspection Area: Displays equipment used for billboard inspection and quality control.

Integrated Circuit Design and Chip Manufacturing Integrated Circuit Design: Different types of integrated circuit design including processors, memory, sensor chips, etc. Chip manufacturing: covering wafer processing, chip packaging, testing and other aspects.

Third-generation semiconductors GaN (gallium nitride), SiC (silicon carbide) and other wide bandgap semiconductor materials and applications.

Wafer Manufacturing and Packaging Wafer manufacturing technology, processes and equipment, including cutting, polishing, cleaning, etc. Packaging technologies, such as flip chip, fan-out packaging, system-level packaging, etc.

Semiconductor equipment and special equipment for semiconductor manufacturing, including all equipment involved in front-end and back-end processes.

Other related technologies and services: semiconductor design software, EDA tools, IP cores, etc. Semiconductor test and measurement technology. Semiconductor industry consulting services, intellectual property rights, education and training, etc.