Printed Electronics Technology Fair In Munich, Germany

Printed Electronics Technology Fair in Munich, Germany

LOPEC

Presentation of the exhibition

The Munich Printed Electronics Technology Fair (LOPEC) is Germany’s leading trade fair for printed electronics technology.
The Printed Electronics Technology Exhibition (LOPEC) in Munich, Germany, offers visitors the opportunity to discover trends and test the suitability of technological developments. From research to market introductions, all extensive products and solutions for organic and printed electronics are on display. LOPEC, the latest exhibition of the Printed Electronics Technology Exhibition in Munich, Germany, has a total area of ​​13,000 square meters and features 253 exhibitors from the United Kingdom, Russia, Norway, Japan, China, Spain and Brazil.
Printed electronic components, such as ultra-thin sensors or microfluidic chips, are paving the way for new medical applications and printed electronics are ready for use in the healthcare sector.

Exhibition address: New International Exhibition Center Munich

Sponsoring organization:Munich Fair

Standard stand price:

Gross space stand price:

Detention period:Once a year
Exhibition space:13,000 square meters
Number of exhibitors:253
Number of visitors:10,000 people

Things to note:The time and location of the exhibition are subject to change, so please confirm before attending.

Scope of the exhibition

Material:Substrates, conductors, semiconductors, dielectrics, packaging materials, resins and adhesives, other materials
Manufacturing process:Quality modeling technology, digital printing, other printing processes, photolithography technology, laser processing, coating technology, light induction processing, food mixing technology, clean room laminating technology, other manufacturing processes

Applications and services:Computer backplanes, monitors, speakers, other applications, consulting, R&D fund management, manufacturing, technical books, technical publishers, other services;
Electronic assembly and packaging, system integration:Electronic assembly and packaging, electronic assembly and packaging, lamination, system integration hybrid systems
equipment:Integrated circuits, displays, transistors, diodes, passive components, photovoltaic cells, sensors, storage components, antennas, battery packs, hybrid system components, other devices

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International Exhibition Center, No. 1 Furniture Avenue, Houjie Town, Dongguan City, Guangdong, China

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