NEPCON Vietnam
NEPCON Vietnam, the electronic components production materials and equipment exhibition in Hanoi, Vietnam, is a series of NEPCON electronic components exhibitions. Companies from all over the world participate in the exhibition and attract a large number of visitors.
NEPCON Vietnam, the electronic components production materials and equipment exhibition in Hanoi, Vietnam, is organized by British Reed Exhibitions. The exhibition is held once a year. 429 companies participated in the exhibition and 10,000 visitors. Hanoi International Convention and Exhibition Center. The exhibition area reaches 12,000 square meters.
The scale of economic and trade cooperation between China and Vietnam is also expanding day by day, and trade cooperation in the field of electronic import and export has become a new growth point to promote economic and trade cooperation between the two countries.
Vietnam has become the manufacturing center of advanced electronics in ASEAN. Many major electronics manufacturers from Japan and South Korea, such as Canon, Samsung, LG, Brother, FUJI, etc., have set up factories near Hanoi to expand their business opportunities. In addition, Microsoft and Nokia have also established factories near Hanoi. Bac Ninh province has invested and established a factory.
Exhibition address: National Exhibition and Convention Center, Hanoi
Organizer:Reed exhibitions
Standard stand price:
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Gross space stand price:
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Holding cycle:Once a year
Exhibition area:12,000 square meters
Number of exhibitors:429 housing units
Number of visitors:10,000 people
Precautions:The time and location of the exhibition are subject to change, so please confirm before attending.
Electronic component: Semiconductors, sensors and microsystems, passive components, displays, system components, electromechanical components and packaging technology, welding materials and technology, electromechanical equipment, semiconductor production technology and processes, switch production technology and equipment, connectors, cables, plugs Devices, assembly parts / Module production technology, ED / EDA test and measurement technology, LCD / LED, display modules, optoelectronic technology and equipment, etc.
Sub-production equipment: Semiconductor and integrated circuit manufacturing equipment, electronic component manufacturing equipment, SMT component production and placement equipment, PCB printed circuit board technology equipment manufacturing, insertion, soldering, ultrasonic, cleaning equipment, component molding equipment, electronic molds, drying test equipment, anti-electrostatic technology, special electronic environmental purification and water vapor purification technology equipment, engineering equipment, electronic chemicals, packaging technology and equipment, special electronic tools, power tool equipment, other types of electronic equipment, etc.