China (Shanghai) International Electronic Thermal Conductivity and Heat Dissipation Materials and Equipment Exhibition

The China (Shanghai) International Electronic Thermal Conductive Materials and Equipment Exhibition, CTHIE (abbreviation: Shanghai Electronic Thermal Conductive Materials Exhibition), will be held at the Shanghai New International Expo Center from November 28 to 30, 2024. The specific location of the exhibition center is No. 2345, Longyang Road, Pudong New District, Shanghai, China.

Shanghai Electronic Thermal Conductive Materials Exhibition is an international professional exhibition focusing on the field of electronic thermal conductivity and heat dissipation. The exhibition is dedicated to displaying the latest electronic thermal conductivity and heat dissipation materials, equipment and technologies to promote the development and innovation of the entire industry. The exhibition covers products from the entire industry chain, from thermally conductive fillers to thermal interface materials, heat dissipation materials for thermal management and their production equipment. Exhibitors include well-known enterprises and brands from all over the world, which display the latest technologies and products here, providing visitors with a wide range of choices and references. In addition, the exhibition also pays attention to industry exchanges and cooperation, inviting many industry experts, scholars and entrepreneurs to participate. By sharing experiences, exchanging ideas and discussing future development trends of the industry, it promotes industry interaction and cooperation. electronic thermal conductivity and cooling industry. There will also be a number of special forums and seminars during the exhibition, focusing on cutting-edge issues and technical challenges in the field of electronic thermal conductivity and heat dissipation, providing participants with the opportunity to gain an in-depth understanding of industry trends and technological progress.

The organizers and responsible persons of Shanghai Electronic Thermal Conductive Materials Exhibition are Guangdong Adhesive Industry Association and Shenzhen Graphene Association. The exhibitors list and exhibitor list of the exhibition are as follows: Lianrui, Wanwei Thermal Conductivity Technology, CMP, Herun, Nano Technology, Boding, Bonding Technology, Hongfucheng, Zhongyi Carbon Technology, etc.

Tickets for the Shanghai Electronic Thermal Conductive Materials Exhibition are e-tickets. When applying for tickets, you need to link your ID card information with your real name. You can enter the exhibition with your ID card and e-ticket.

Thermally conductive graphite: graphene, thermally conductive graphite material, graphite film, graphite heat dissipation film, thermally conductive graphite, graphite heat sink, graphite film, graphite insulating film, graphite film roll, related equipment

Thermally conductive and heat dissipation materials: liquid metal thermal conductive sheet, silicone sheet, thermally conductive silicone fabric, film/tape, thermally conductive silicone, thermally conductive silicone grease, thermally conductive gel, thermally conductive potting glue, thermally conductive pad/carbon fiber thermally conductive pad, polymer-based thermally conductive composite material, liquid metal, thermally conductive potting glue

Electronic packaging materials include: non-metallic organic materials (such as aluminum oxide, silicon oxide, zinc oxide, boron nitride, aluminum nitride, silicon nitride, silicon carbide, magnesium oxide, beryllium oxide, graphite, carbon black, etc.), metal materials (such as aluminum, copper, copper-beryllium, tungsten/copper, molybdenum/copper, silicon/aluminum, beryllium/aluminum, metal foam/porous metal, etc.)

Thermal conductive and heat dissipation components: heat pipes/vapor chambers, copper-clad power devices (such as silicon carbide, gallium nitride, gallium oxide, MOSFET, IGBT) and modules

Analysis and detection instruments: laser thermal conductivity meter, thermal conductivity analyzer, thermal conductivity meter, thermal expansion meter, electronic thermal tester, air volume and pressure tester, laser thermal conductivity meter, material strength testing machine, thermal physical property measuring equipment

Thermal conductive filler: non-metallic inorganic materials (such as alumina, silicon oxide, zinc oxide, boron nitride, aluminum nitride, silicon nitride, silicon carbide, magnesium oxide, beryllium oxide, graphite, carbon black, etc.)