BIND
Exhibition Address: Shenzhen International Convention and Exhibition Center (New Hall)
Sponsoring organization:Electronic Materials Branch of China Electronics Society
Standard stand price:
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Gross space stand price:
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Holding period:Once a year
Exhibition space:30,000 square meters
Number of exhibitors:430
Number of visitors:30,000 visitors
Things to note:Exhibition time and location are subject to change, so please confirm before attending.
Glue distribution and injection supplier:Automatic dispenser, dispensing robot, glue filling machine, automatic glue feeding equipment, visual desktop robot, glue coating equipment, laminating equipment, UV transfer equipment, coating equipment, coating testing equipment , injection valve, tray loading machine, screw machines, complete line solutions, automated production lines, peripheral equipment and accessories, etc.
Welding equipment supplier:Welding robot, soldering equipment, tin furnace, desoldering station, hot air gun, constant temperature heating equipment, flux spray furnace, tin dipping machine, automatic solder paste printing machine , tin furnace dipping equipment, manipulator welding robot, plug-in automatic welding robot, solder smoke extraction equipment, solder paste anti-fool equipment, beam welding Electron Patch, SMT Patch DIP Welding, PCB Soldering and Connection Technology, Laser Plastic Welding Technology, Spectrometer, Oxygen Analyzer, Imager, Dry Sieve, Laser Particle Size Analyzer, Tin Bar Coder , anode rod casting machine, anode rod cutting machine, tin melting furnace, tin powder machine, vibrating screen, tin powder production line, vacuum emulsifier, solder paste mixer, hydraulic discharge machine, vibrating powder screening equipment, etc.
Welding materials supplier:Solder paste, tin powder, tin bar, tin wire, red glue, flux, tin ball, tin ingot, anode rod, red glue, tin-zinc wire, alloy tin-zinc, copper-aluminum cored solder wire, copper-aluminum solder wire, strippable glue, conformal paint, PCB ink, thinner, wash water/wiping machine water, electroplating anode plate, CCGA copper pillar, tin pillar, soldering accessories, etc.