Global Chip Industry Chain Exhibition and Summit in Shenzhen

Policy Guidelines:

Chips are the core of the modern electronics industry and a strategic, fundamental and leading industry for the development of the national economy and society. “Integrated circuits” and “chips” continued to gain popularity during the two national sessions, and many “main” voices released national broadcasts.

According to strategic and industry indicators, the size of the chip market is expected to exceed 100 billion yuan by the end of 2024.

Geographic advantages:

As one of the important bases of electronic information industry with the largest scale and highest comprehensive level in my country, Shenzhen is the

The most influential chip application market.

For this reason, Shenzhen has also gathered many traders and investors in the chip industry from home and abroad. Shenzhen was chosen as the venue for the conference, drawing on

Shenzhen’s deep technological accumulation and thriving chip trading market provide participating companies and traders with a platform for technical and

A complete platform for product presentation and commercial negotiation.

Authoritative endorsement:

The 2024 Global Chip Industry Chain Exhibition and Summit is supported and organized by Shenzhen Municipal People’s Government, Shenzhen Electronic Industry Association, Chip Industry Research Institute chips from CIRI and other member units that fully support hundreds of authoritative media outlets; “Exhibition + Conference + Competition”, three authoritative events are combined to create the only professional event covering the industry and applications.

The exhibition provides a leading platform for dialogue and cooperation in the global chip industry and application areas.

Artificial intelligence chip exhibition area:

◆ Vehicle grade chips, driver chips, transportation electronic chips, etc. ;

◆ Consumer electronic chips, medical chips, display chips, computer and control chips, etc. ;

◆ IoT chips, 5G chips, communication chips, memory chips, etc. ;

◆ Power management chips, electrical appliance chips, etc., LED lighting and display driver chips, etc. ;

◆ Beacon chips, audio, video and image processing chips, semiconductor chips, optical chips, etc. ;

Chip manufacturing materials and equipment exhibition area:

◆ Single crystal silicon, silicon wafers, silicon germanium materials, S01 materials, solar cell silicon materials and compound semiconductor materials, quartz products, stone products, anti-static materials, nano materials, etc.

◆ Third generation semiconductor silicon carbide SiC, gallium nitride GaN, wafers, substrates, packaging, testing, optoelectronic devices, etc.

◆ Semiconductor packaging equipment, semiconductor diffusion equipment, semiconductor welding equipment, semiconductor cleaning equipment, semiconductor testing equipment, semiconductor refrigeration equipment, semiconductor oxidation equipment, etc.

◆ Single crystal furnace, oxidation furnace, ion implantation equipment, PVD, CVD lithography machine, engraving machine, chamfering machine, heat treatment, coating equipment, etc.

Chip Design and Advanced Packaging and Testing Exhibition Area:

◆ Design of integrated circuits and associated electronic products

◆ Advanced SiP packaging, OSAT, EMS, OEM, IDM, silicon wafers and IC packaging carrier boards, etc. ;

◆ Printed circuit boards, substrates and packaging equipment, assembly and testing, etc. ;

◆ Packaging design, testing, equipment and application manufacturing, packaging testing, etc. ;

◆EDA, MCU, printed circuit boards, packaging substrates, semiconductor materials and equipment, etc. ;

Exhibition area of ​​chip terminal application innovation achievements:

◆ Internet of Things, artificial intelligence, automotive electronics, etc.;

◆ Smart terminals, smart cloud computing, smart cities, etc. ;

◆ Medical health, industrial applications, etc. ;