Global Semiconductor Industry Exhibition (Chengdu)

The Global Semiconductor Industry (Chengdu) Expo GISE (abbreviation: Chengdu Semiconductor Exhibition) will be held from November 6 to 8, 2024. The exhibition venue is Chengdu Century New City International Convention and Exhibition Center, and its specific address is No. 198 Century City Road, Chengdu City, Sichuan Province.

The Chengdu Semiconductor Exhibition is a highly influential international semiconductor exhibition in the central and western regions. It is an industrial event that integrates “exhibition and display, communication and promotion, matching supply and demand and interactive experience”. It is committed to creating a high-end semiconductor display and communication space and becoming an important player in promoting the implementation of industrial chain projects and sharing opportunities. With the development of the exhibition, its size and the number of participating companies have doubled year by year, reflecting the increasing attention and investment of semiconductor companies in Sichuan and Chongqing regions. The exhibition focuses on all aspects of the semiconductor industry, including integrated circuit manufacturing, packaging and testing, semiconductor materials, production equipment and other special fields. At the same time, it is also an important platform for training and exchange of talent plans, attracting the participation of universities such as the Chinese Academy of Sciences, Tsinghua University and University of Science and Technology of China, senior representatives of major companies, and industry experts. These experts and representatives will together discuss industry hotspots and development opportunities in the southwest market.

The organizers and managers of the Chengdu Semiconductor Expo are the Chongqing Semiconductor Industry Association and the Chongqing Electronics Society. The exhibitor list and exhibitor list of the exhibition are as follows: Huawei, United Microelectronics, Digital China, CCID, Hikvision, China Resources Microelectronics, Semiconductor, Lingjiuwei, Keyence, Kailing Technology, Jihai Semiconductor, Mumuxili, CETZ, Huada Semiconductor, etc.

Chengdu Semiconductor Exhibition tickets are e-tickets. When applying for tickets, you must link your ID card information to your real name. You can access the exhibition with your ID card and e-ticket.

Semiconductors, Integrated Circuit Design and Manufacturing, Packaging: Integrated Circuit Design and Chips, Chip Design Tools, Software and Testing, Wafer Fabrication, Advanced SiP Packaging, Power Device Packaging and Testing, Packaging and Testing MEMS, advanced packaging technology (chiplet), silicon Round wafer and IC packaging support boards, packaging substrates and testing manufacturing and packaging applications, packaging substrates, materials, equipment and semi components -drivers, etc.

Equipment manufacturing area: thinning machines, single crystal furnaces, oxidation furnaces, grinding, polishing, heat treatment equipment, photolithography machines, engraving machines, ion implantation equipment, plotting, CVD/PVD/ALD , PECVD equipment, MOCVD, coating glue, developing machine, gluing machine, cutting machine, cleaning equipment, film loading machine, engraving, optical vacuum coating, Imaging and measuring test (microscope/spectrometer/interferometer/optical measuring and detection instrument/optical design software/optical platform and moving stage, etc.), optical instruments, lenses and cameras (lenses/lenses), laser equipment, bonding machines , testing machines, sorting machines, vacuum fluids, testing equipment, refrigeration equipment, oxidation equipment, clean room equipment;

Semiconductor materials field: third generation semiconductor materials, silicon wafers and silicon-based materials, optical masks, high purity gases, electronic special gases, wet electronic chemistry, photoresists and theirSupport reagents, CMP polishing materials, targets, optical fibers, encapsulation materials, nanomaterials, chip bonding materials, pipeline valves, crystals, quartz, sapphire, graphene, etc. ;

Automotive electronics: automotive-grade solid-state main control/AI chips, power semiconductors (1GBT and MOSFET), automotive-grade SiC modules, power management chips, electronic micro-assemblies and devices automotive power supply, advanced automotive grade packaging technology, intelligent network connection, intelligent driving cockpit chip CPU and MCU storage chip, GPU image processing, vision processing chip, vision, sensing technology, radar technology , optical system, intelligent decision-making technology, high-precision positioning and mapping system, design, development and testing solutions are waiting;

Electronic components: passive components, sensors, memories, connectors, relays, cables, wire harnesses, plug-in devices, crystal oscillators, resistors, instrumentation, displays, diodes, transistor filter components, switches and control materials and equipment components, ceramic magnetic materials, printed circuit board substrates, etc.;

Testing and measurement: electronic and communication instruments, electrical instruments, environmental testing instruments and equipment, analytical instruments, certification tests, automated instrumentation, etc. ;

New smart displays and terminals: displays and applications, 3D glass, touch screen modules, AR/VR/MR equipment, mobile phones/laptops/computers/smart bracelets, wearable devices, intelligent robots, audio-visual equipment, industrial terminals, etc. . ;

Intelligent power supply area: microwave radio frequency, semiconductor LED, power management chip, plasma power supply, module power supply, laser power supply, AC power supply, DC power supply, communication power supply, special power supply, manufacturing equipment power supply and auxiliary materials, power supply related software, photovoltaic/wind power/storage power supply design, military industry, magnetic power converter technology, etc.

Smart manufacturing: SMT technology and equipment, automotive electronics and consumer electronics assembly equipment, smart factories, smart warehouses, smart robots, welding and distribution technology, AI+5G, industrial Internet platform, connection smart car network, anti-static, clean and purified. wait;

Comprehensive exhibition area: government groups across the country, high-tech industrial parks in semiconductor-related fields, securities, banks, insurance, funds, investment financial institutions, trading fields, etc.