China International Semiconductor Exhibition in Beijing

IC China (named: Beijing Semiconductor Exhibition) will be held from September 5 to 7, 2024 at the Beijing Yichuang International Convention and Exhibition Center, located at No. 6 East Rongchang Street, Yizhuang, Beijing.

Since 2003, the Beijing Semiconductor Exhibition (IC China) has been successfully held for 20 consecutive sessions, becoming the most authoritative and professional flagship event in China’s semiconductor industry. The exhibition adheres to the core concept of “industry-wide resource integration and promotion of large-scale industry docking”, focusing on the depth and breadth of the chain semiconductor industry, as well as super-large-scale application scenarios, comprehensively demonstrating the latest development trends and innovative achievements of semiconductor technology. By bringing together industrial resources from around the world, IC China Expo aims to strengthen the core competitiveness of enterprises in the current transformation process of the semiconductor industry and enable participants to compete in domestic markets and foreigners thanks to technological innovation and a narrow industrial chain. collaboration in the supply chain. Seize the opportunity and create a win-win situation together.

The organizer and official of the Beijing Semiconductor Expo is the China Semiconductor Industry Association. The exhibitor list and exhibitor list of the exhibition are as follows: Yangtze Memory, Huahong Group, BGI Jiutian, Changdian Technology, Northern Huachuang, Lens Technology, Archimedes Semiconductor, Woyi Microelectronics, Huawei, Hengshuo Semiconductor, Mitsukoshi Semiconductor, Yuexin Technology, Loongson Zhongke. , Hefei Zhaoxin Electronics, Zhongwei Tengxin, Huahong Grace, Xingchen Tianhe, Xinwang Microelectronics, etc.

Tickets for the Beijing Semiconductor Exhibition are e-tickets. When applying for tickets, you must link your ID card information to your real name. You can access the exhibition with your ID card and e-ticket.

Artificial intelligence chips and related products: display chips, driver chips, power management chips, electrical appliance chips, sensor chips, Internet of Things chips, communication chips, transportation electronic chips, computer and control chips, semiconductor chips, memory chips, 5G chips, automotive regulatory grade chips, medical chips, audio and video processing chips, chip design

Chip manufacturing equipment: chip packaging, testing equipment, chip material processing equipment, semiconductor special equipment and materials

Semiconductor packaging equipment: semiconductor diffusion equipment, semiconductor welding equipment, semiconductor cleaning equipment, semiconductor testing equipment, semiconductor refrigeration equipment, equipment semiconductor oxidation

Semiconductor materials: single crystal silicon wafers, silicon germanium materials, SOI materials, solar cell silicon materials, compound semiconductor materials, quartz products, graphite products, antistatic materials

Semiconductor design, packaging and test, and manufacturing manufacturers: semiconductor design companies, packaging and test service providers, semiconductor manufacturers

Raw materials: silicon wafers, silicon wafers, photoresist, masks, electronic gases and special chemical gases, CMP polishing materials