2025 Stuttgart adhesives and Bondexpo sealing exhibition

Bondexpo is the first world industry and user collection. Thanks to the adhesive bond, repotting, waterproofing and foam, the company has a clear and coherent accent on connection / adhesion process channels, providing profitable detailed system solutions for current and future challenges in the Connect and binding a wide range of fields of materials. This is particularly applicable to the miniaturization of light structural technology or microsystem applications through mixing materials / mixing design, thus increasing new requirements in terms of resource, materials and energy efficiency. Suppliers of adhesive liaison technology will find the ideal environment here to show themselves to the world of world production world.

The 43rd Modek Production and Assembly International International Trade will take place jointly with the 18th International Bondexpo Trade Show for Bondexpo, and the three -day fall event will offer to manufacture effective automation solutions for the future. Traditional professions will provide new impetus in terms of economy and flexibility.

“The preparations for Motek / Bondexpo 2025 are under full speed,” said Rainer Bachet, a longtime project manager for traditional events for the promoter of the Peschall trade fair. “The ticket allowance is about to start.

The trade fair launcher reduces the traditional Modek / Bondexpo exhibition to three days to make visits to exhibitors and expert visitors to the manufacturing industries more efficient. In 2025, an additional program focused on the theme – corresponded perfectly to the target group – will end the successful visit of the exhibition, will take charge of the creation of networks and will help to establish new commercial connections.

Subjects covering the entire manufacturing value chain

Manufacturing companies are faced with major challenges – efficiency, profitability and resource savings, as well as fulfilling the shortage of qualified personnel, are at the center of people’s attention. In an atmosphere of work focused on the theme and an exchange of ideas focused on practice, production automation experts will discuss the way of improving manufacturing processes on the industry platform tested supplied by Modek / Bandexpo.

The trade fair covers the entire production program, including intelligent and intelligent production components and systems, assistance systems and assembly workstation systems, easy -to -implement and debugging solutions , as well as the recognition and image processing of objects, food technology and software. Traditional trade fairs provide components and solutions adapted to future processes to all those who wish to automate production processes or functions. The theme of the trade fair is easily focused on starting automation, easily digitizing production components and sustainability as a factors for economic success. For example, exposure will include robotics in assembly and manipulation, examples of how artificial intelligence can be used in production, automatic identification of online parts detection, planning software assembly and connection between tests and flexible quality production and control.

System components

Bachet said: “MODEK / BONDEXPO is an ideal commercial platform for producing solutions throughout the value-added chain.” “Effective automation for the future” has once again become our motto for 2025. “The agreement will imply solutions for economic production and the automation of assembly, covering everything, components and modules to subsystems and complete solutions. The treatment, the treatment of metals, wood work, electronics and electrical engineering, as well as laboratory automation, health care and medical technology. is a key objective, it must be based on solutions oriented to the future and is easy to implement. “”

Adhesive and sealing: Coatry adhesives and products