Japan Integrated Circuit and Sensor Packaging Technology Exhibition in Tokyo

IC & SENSOR PACKAGING TECHNOLOGY EXPO in Tokyo, Japan is the best professional packaging technology exhibition in Japan. This is an exhibition dedicated to showcasing semiconductor/sensor and other electronic device packaging technologies. IC and Sensor Packaging Technology Expo in Tokyo, Japan IC Sensor Packaging Technology Expo is a good place for business negotiations between engineers from the semiconductor and sensor industry and other industries such as semiconductor, sensors, electronic equipment and automobiles.
The total area of ​​the previous exhibition (IC & SENSOR PACKAGING TECHNOLOGY EXPO) in Tokyo, Japan was 16,000 square meters, with 375 participating companies from China, South Korea, Taiwan, India, Thailand, in Malaysia and Singapore, Turkey. Germany and other places.
The IC & SENSOR PACKAGING TECHNOLOGY EXPO in Tokyo, Japan is highly professional and achieves good business results, attracting many high-tech equipment enthusiasts, users and industrial audiences.

Equipment & Equipment, Packaging Materials/Components, SATS/Contract Design Services, Electroplating/Etching Materials & Equipment, MEMS Packaging Equipment/Equipment, IC Packaging Analysis/Simulation Software, Packaging Devices/Equipment solid state test